Title:
ポリイミド系ブロック共重合体及びこれを含むポリイミド系フィルム
Document Type and Number:
Japanese Patent JP6724992
Kind Code:
B2
Abstract:
The present disclosure relates to a polyimide-based block copolymer and a polyimide-based film including the same. The polyimide-based block copolymer according to the present disclosure makes it possible to provide a polyimide-based film having a large molecular weight and exhibiting colorless and transparent properties.
Inventors:
Choi, Song Yeol
Kim, Byung Guk
Kim, Sang Gon
Jean, Dukhun
Choi, Hyun Sam
Kim, Byung Guk
Kim, Sang Gon
Jean, Dukhun
Choi, Hyun Sam
Application Number:
JP2018532087A
Publication Date:
July 15, 2020
Filing Date:
October 12, 2017
Export Citation:
Assignee:
LG HAUSYS,LTD.
International Classes:
C08G73/10; C08J5/18
Domestic Patent References:
| JP2006131706A |
Foreign References:
| CN105461924A | ||||
| KR1020110010009A |
Attorney, Agent or Firm:
Longhua International Patent Service Corporation