POLYIMIDE FILM, ITS MANUFACTURING METHOD AND METALLIC WIRING PLATE USING THE SAME AS BASE

Title:

POLYIMIDE FILM, ITS MANUFACTURING METHOD AND METALLIC WIRING PLATE USING THE SAME AS BASE

Document Type and Number:

Japanese Patent JP2002155140

Kind Code:

A

Abstract:

To provide a polyimide film having an excellent high elastic modulus, low thermal expansion coefficient, alkali etching properties, and film-forming properties when the polyimide film is applied to a metallic wiring plate base for a flexible printing circuit applying a metallic wiring to its surface, CSP, BGA, or a TAB tape, and to provide a manufacturing method of the polyimide film, and a metallic wiring circuit plate using the film as a base.

The polyimide film is obtained by copolymerizing pyromellitic dianhydride, phenylenediamine, methylene-dianiline, and 3,4'-oxy-dianiline at a specified mole ratio thereof.

More Like This:

JP2002003619	POLYOLEFIN STRETCHED FILM
JP2007524527	Non-gelatin film and methods and equipment for producing it
JP3766263	HEAT-RESISTANT FILM, AND FLEXIBLE PRINT WIRING SUBSTRATE COMPRISING THE SAME AS BASE MATERIAL

Inventors:

UHARA KENJI
YASUDA MASABUMI
SAWAZAKI KOICHI

Application Number:

JP2001251095A

Publication Date:

May 28, 2002

Filing Date:

August 22, 2001

Export Citation:

Click for automatic bibliography generation Help

Assignee:

TORAY DU PONT KK

International Classes:

C08J5/18; B29C41/24; C08G73/10; H01L21/60; H05K1/03; B29K79/00; B29L7/00; (IPC1-7): C08G73/10; B29C41/24; C08J5/18; H01L21/60; H05K1/03

Attorney, Agent or Firm:

Atsushi Ebiya

Previous Patent: SOLVENT-SOLUBLE BLOCK POLYIMIDE COMPOSITION FOR LIQUID CRYSTAL ORIENTATED FILM AND ITS MANUFACTURING...

Next Patent: ELECTROLYTE COMPOSITION, PHOTOELECTRIC CONVERSION ELEMENT AND PHOTOELECTRIC CELL