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Patent Searching and Data


Title:
POLYIMIDE FILM AND MANUFACTURING METHOD FOR LAMINATED PRODUCT
Document Type and Number:
Japanese Patent JP2005239747
Kind Code:
A
Abstract:

To prepare a polyimide film of a continuous length continuously manufactured at a specified width which is suitable for base films for TAB (tape automated bonding) or FPC (flexible print circuit), or the like, and causes no torsion even if any portion in the width direction is used for a metal laminate.

The polyimide film is continuously manufactured at a width of at least 1,000 mm and gives a distortion ratio of a specified value or less over the entire width when subjected to a trouser tear testing in the MD direction. The polyimide film contributes also to avoidance of troubles and enhancement in speed in a slitting process.


Inventors:
ITO TOSHINAO
ONO KAZUHIRO
Application Number:
JP2004047426A
Publication Date:
September 08, 2005
Filing Date:
February 24, 2004
Export Citation:
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Assignee:
KANEKA CORP
International Classes:
C08J5/18; B29C41/24; B32B15/08; B32B15/088; B29K79/00; B29L7/00; (IPC1-7): C08J5/18; B29C41/24; B32B15/08
Domestic Patent References:
JPH1077353A1998-03-24
JP2002361663A2002-12-18
JP2002321235A2002-11-05
JP2001162631A2001-06-19
JP2003073473A2003-03-12