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Title:
POLYIMIDE FILM
Document Type and Number:
Japanese Patent JP2007253516
Kind Code:
A
Abstract:

To provide a polyimide film which shows an excellence in thermal resistance and a mechanical property, and shows suppressed generation of a whisker-like object on the end surface of a slit.

A polyimide film is obtained by slitting with a laser beam or with a cutter, the cutter being exchanged or the blade being renewed so that the surface area of the slit does not exceed 0.045 m2. The number of the whisker-like object protruding by 2 μm or more from the end surface of the film (cut disorder) is within one per 100 μm of the film length.

COPYRIGHT: (C)2008,JPO&INPIT


Inventors:
EJIMA AKINORI
ISOHAMA YOICHI
OKUYAMA TETSUO
MAEDA SATOSHI
KAWAHARA KEIZO
Application Number:
JP2006082634A
Publication Date:
October 04, 2007
Filing Date:
March 24, 2006
Export Citation:
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Assignee:
TOYO BOSEKI
International Classes:
B29D7/01; C08J5/18; B32B15/088
Domestic Patent References:
JP2001011421A2001-01-16
JP2005064265A2005-03-10
JP2005187771A2005-07-14



 
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