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Patent Searching and Data


Title:
POLYIMIDE FILM
Document Type and Number:
Japanese Patent JP2009013245
Kind Code:
A
Abstract:

To provide an extremely thin and long film with less uneven thickness of a polyimide film excellent in heat resistance and mechanical properties.

The polyimide film has a thickness of not more than 7 m and thickness unevenness of not more than 20%. For example, a polyimide precursor film or a polyimide film which is slit into a small width and separately prepared from a film to be processed is superposed on both side ends of the film to be processed, and the side ends of the film are held together with the slit film by sticking pins or pinching with clips, and the polyamic acid is imidized so as to prevent the film from fracturing into a long hole form in the longitudinal or width direction to the film and from aggravating the uneven thickness.


Inventors:
EJIMA AKINORI
TSUTSUMI MASAYUKI
KAWAHARA KEIZO
TAKASE SATOSHI
Application Number:
JP2007174885A
Publication Date:
January 22, 2009
Filing Date:
July 03, 2007
Export Citation:
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Assignee:
TOYO BOSEKI
International Classes:
C08J5/18; C08G73/10
Domestic Patent References:
JP2006045353A2006-02-16
JPH11254521A1999-09-21
JP2008115245A2008-05-22
JP2007069562A2007-03-22