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Title:
POLYIMIDE PRECURSOR COMPOSITION AND USE THEREOF
Document Type and Number:
Japanese Patent JPS63142030
Kind Code:
A
Abstract:

PURPOSE: To obtain the titled composition useful for insulating film, etc., capable of being polyimidated by patterned irradiation of semiconductor laser to simply form fine patterns, by blending a polyamic acid of polyimide precursor with a near ultraviolet light absorbing dyestuff.

CONSTITUTION: (A) A polyamic acid of polyimide precursor is blended with (B) preferably 0.5W40wt% near ultraviolet light absorbing dyestuff (e.g. Phthalocyanine dyestuff, etc.) to give the aimed composition having properties of being imidated by laser light. In order to form patterns by using the composition, the composition is dissolved in a solvent, which is applied to a substrate. The coated film is irradiated with semiconductor laser light and imidated.


Inventors:
IWAMOTO MASAO
GOTO TETSUYA
Application Number:
JP28888286A
Publication Date:
June 14, 1988
Filing Date:
December 05, 1986
Export Citation:
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Assignee:
TORAY INDUSTRIES
International Classes:
C08L79/08; C08G73/10; C08K5/00; G03C1/73; G03F7/027; G03F7/028; G03F7/038; (IPC1-7): C08G73/10; C08K5/00; C08L79/08; G03C1/71
Domestic Patent References:
JPS60184205A1985-09-19
JPS60184203A1985-09-19
JPS60235860A1985-11-22
JPS62179565A1987-08-06



 
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