Title:
ポリイミド前駆体、架橋構造を有するポリイミドおよびその製造方法
Document Type and Number:
Japanese Patent JP6665862
Kind Code:
B2
Abstract:
Provided is a polyimide precursor with which it is possible to easily produce a polyimide having suitably high crosslinking density. Also provided is a polyimide having excellent heat resistance, as well as excellent dimensional stability at high temperatures. This polyimide precursor includes: a tetracarboxylic acid (a) represented by formula (1), for example; and an amine compound (b) having three or more amino groups and represented by formula (3), for example. Formula (1): X1 represents a direct bond or a divalent group. Formula (3): Z1 represents a trivalent or higher-valent group, Z2 represents a direct bond or a divalent group, R1 to R4 represent a monovalent group, n1 represents an integer of 3 or more, m1 and m3 represent an integer from 0 to 4, and m2 and m4 represent an integer from 0 to 3.
Inventors:
Ryoichi Takazawa
Application Number:
JP2017546573A
Publication Date:
March 13, 2020
Filing Date:
October 19, 2016
Export Citation:
Assignee:
Ube Industries,Ltd.
International Classes:
C08G73/10; B32B15/088; B32B17/10; B32B18/00; B32B27/34
Domestic Patent References:
| JP2003213128A | ||||
| JP2004175946A | ||||
| JP2010209137A | ||||
| JP2001332543A | ||||
| JP10045918A |
Attorney, Agent or Firm:
Katsuhiro Ito