ポリイミド樹脂およびそれを用いた導体付きフィルム

Title:

ポリイミド樹脂およびそれを用いた導体付きフィルム

Document Type and Number:

Japanese Patent JP4925619

Kind Code:

B2

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Inventors:

Oka Osamu

Application Number:

JP2005219679A

Publication Date:

May 09, 2012

Filing Date:

July 28, 2005

Export Citation:

Assignee:

Tomagawa Paper Mill Co., Ltd.

International Classes:

C08G73/10; B32B15/08; B32B15/088; H05K1/03

Domestic Patent References:

Previous Patent: JPS4925618

Next Patent: JPS4925620