POLYIMIDE RESIN, METHOD FOR PRODUCING THE SAME, ADHESIVE COMPOSITION USING THE SAME, ADHESIVE SHEET, PRINTING INK COMPOSITION, AND PRINTED CIRCUIT BOARD

Title:

POLYIMIDE RESIN, METHOD FOR PRODUCING THE SAME, ADHESIVE COMPOSITION USING THE SAME, ADHESIVE SHEET, PRINTING INK COMPOSITION, AND PRINTED CIRCUIT BOARD

Document Type and Number:

Japanese Patent JP2010155975

Kind Code:

A

Abstract:

To provide an adhesive composition having heat resistance, low-temperature adhesiveness, and insulation reliability at the same time, in particular, an adhesive composition useful for a printed circuit board, a sheet of the adhesive composition, a printing ink, and a printed circuit board using these.

A polyimide resin, which has an acid value of 30-300 eq/106g, is prepared by graft-polymerizing a radical-polymerizable monomer with a polyimide resin, which is prepared by copolymerizing one or more compounds selected from the group consisting of an aliphatic polyester having a carboxyl group or a hydroxyl group at the terminus, a butadiene rubber and a dimer acid.

Inventors:

INUKAI TADASHI

Application Number:

JP2009258776A

Publication Date:

July 15, 2010

Filing Date:

November 12, 2009

Export Citation:

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Assignee:

TOYO BOSEKI

International Classes:

C08F283/04; C08G73/10; C09D11/00; C09J7/02; C09J11/06; C09J151/08; C09J163/00; C09J175/04; C09J179/08

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