Title:
ポリイミド樹脂およびその製造方法、ならびにポリイミドフィルムおよびその製造方法
Document Type and Number:
Japanese Patent JP7323522
Kind Code:
B2
Abstract:
A polyimide resin that has an acid dianhydride–derived structure and a diamine-derived structure, that includes an acid dianhydride that is represented by general formula (1) and a fluorine-containing aromatic acid dianhydride as acid dianhydrides, and that includes a fluoroalkyl-substituted benzidine as a diamine. In general formula (1), n is an integer that is at least 1, and R1–R4 are each independently a hydrogen atom, a C1–20 alkyl group, or a C1–20 perfluoroalkyl group. Relative to a total of 100 mol% of acid dianhydrides, the polyimide resin preferably contains 10–65 mol% of the acid dianhydride that is represented by general formula (1) and 30–80 mol% of the fluorine-containing aromatic acid dianhydride.
Inventors:
Norihiro Yasumoto
Zhang Winter
Hiroyuki after
Yasutaka Kondo
Kohei Ogawa
Masahiro Miyamoto
Zhang Winter
Hiroyuki after
Yasutaka Kondo
Kohei Ogawa
Masahiro Miyamoto
Application Number:
JP2020527466A
Publication Date:
August 08, 2023
Filing Date:
June 20, 2019
Export Citation:
Assignee:
Kaneka Corporation
International Classes:
C08G73/10; C08J5/18
Domestic Patent References:
| JP2004182757A |
Attorney, Agent or Firm:
Patent Attorney Corporation Haruka International Patent Office