Title:
POLYIMIDE RESIN MOLDING COMPOSITION
Document Type and Number:
Japanese Patent JPH03177427
Kind Code:
A
Abstract:
PURPOSE:To provide the subject composition containing a substance produced by clathrating aromatic polyimide resin powder with a compound having maleimide group, capable of keeping high weight-retainability even in a high temperature region (>=300 deg.C) and moldable at low temperature under low pressure. CONSTITUTION:The objective composition contains a substance produced by clathrating aromatic polyimide resin powder (preferably spherical particles pretreated with an alkaline solution or a coupling agent) with a compound having maleimide group (preferably mono or bismaleimide containing unsaturated bond).
Inventors:
AIZAWA TERUKI
HIRAI YASUYUKI
HIRAI YASUYUKI
Application Number:
JP31619189A
Publication Date:
August 01, 1991
Filing Date:
December 05, 1989
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C08K5/3415; C08G73/10; C08L79/08; (IPC1-7): C08G73/10; C08K5/3415; C08L79/08
Attorney, Agent or Firm:
Hirose Akira