PURPOSE: To obtain a polyimide resin molding having good electrical reliability as well as good heat resistance and having a high dielectric breakdown voltage and high electrical reliability even when the thickness of the resin is small.

CONSTITUTION: This polyimide resin molding is prepared by reacting at least one diamine component selected from the group consisting of 2,7- diaminofluorenone, 3,6-diaminofluorenone, 2,6-diaminofluorenone, 2,7- diaminobenzofuran, 3,6-diaminobenzofuran and 2,6-diaminobenzofuran with at least one acid component selected from the group consisting of pyromellitic dianhydride, 4,4'-oxydiphthalic dianhydride and 4,4'-methylenediphthalic dianhydride and molding the reaction product.