Title:
電子部品用ポリイミド基板
Document Type and Number:
Japanese Patent JP7265113
Kind Code:
B2
Abstract:
To provide an HFIP group-containing polyimide that is soluble in a specific organic solvent and allows easy molding of a polyimide substrate, and exhibits excellent transparency and heat resistance as the polyimide substrate; and also provide a polyimide substrate for electronic components having excellent mechanical strength and dimensional stability.SOLUTION: A polyimide substrate for electronic components has a polyimide having a repeating unit (A) represented by the following formula.SELECTED DRAWING: Figure 1
Inventors:
Hiroshi Eguchi
Yukari Hara
Yoshinori Matsunaga
Yukari Hara
Yoshinori Matsunaga
Application Number:
JP2018092210A
Publication Date:
April 26, 2023
Filing Date:
May 11, 2018
Export Citation:
Assignee:
Central Glass Co., Ltd.
International Classes:
C08G73/10; G09F9/30; H05B33/02; H05K1/03; H10K50/00
Domestic Patent References:
| JP2007119504A | ||||
| JP4328891A | ||||
| JP2013010096A |
Foreign References:
| WO2016190170A1 | ||||
| WO2012165455A1 | ||||
| WO2010053185A1 | ||||
| WO2010053186A1 |