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Title:
ポリマー被覆無機フィラー、及び、これを含む樹脂組成物、ドライフィルム、硬化物、電子部品
Document Type and Number:
Japanese Patent JP7360249
Kind Code:
B2
Abstract:
To provide a polymer-coated inorganic filler having excellent dispersibility in a resin or organic solvent, low cost, high production efficiency, and easy introduction of various functional groups, and a curable resin composition, dry film, cured product and electronic component containing the same.SOLUTION: A polymer-coated inorganic filler in which the surface of an inorganic particle is coated with a coating polymer, and which is characterized in that the coating polymer is a polymer or copolymer obtained by polymerizing a radically polymerizable monomer, and the coating polymer has an organic functional group in the side chain via an urethane bond.SELECTED DRAWING: None

Inventors:
Hiroki Sato
Nobuhiro Ishikawa
Application Number:
JP2019069020A
Publication Date:
October 12, 2023
Filing Date:
March 29, 2019
Export Citation:
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Assignee:
Taiyo Holdings Co., Ltd.
International Classes:
C09C1/00; B32B27/20; C08F2/44; C08F8/30; C08K9/04; C08L101/00; C09C3/10; C09D201/00
Domestic Patent References:
JP2008081728A
JP2002338422A
Foreign References:
WO2018084121A1
WO2014025045A1
Attorney, Agent or Firm:
Atsushi Ito