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Patent Searching and Data


Title:
POLYMER COMPOSITION FOR ELECTRONIC MEMBER
Document Type and Number:
Japanese Patent JPH0782469
Kind Code:
A
Abstract:

PURPOSE: To obtain a polymer composition suitable for IC board, etc., having excellent heat resistance, electrical insulating properties, dielectric characteristics, etc., having improved recycle molding, comprising a specific polyetherimide, a prescribed polyphenylene ether and a specific epoxy modified styrenic copolymer.

CONSTITUTION: This composition comprises (A) a polyether imide of formula I (n is 1-100; R1 is group of formula II, formula III, etc.; R2 is group of formula IV, formula V, etc.), (B) a polyphenylene ether of formula VI (Y1 to Y4 are H or methyl) and (C) 0.1-1.0 pt.wt. of an epoxy modified styrenic copolymer based on 100 pts.wt. of total of the components A and B. The component C is preferably a graft copolymer and the composition is preferably further mixed with (D) a silane-based coupling agent and (E) a filler (e.g. whisker or inorganic filler in single fiber state).


Inventors:
WATANABE IKUE
Application Number:
JP18561693A
Publication Date:
March 28, 1995
Filing Date:
June 28, 1993
Export Citation:
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Assignee:
COSMO SOGO KENKYUSHO KK
COSMO OIL CO LTD
International Classes:
C08G59/34; C08K5/54; C08K7/04; C08L71/12; C08L79/08; C08L81/00; C08L81/06; H01B3/42; H01B3/44; (IPC1-7): C08L71/12; C08G59/34; C08K5/54; C08K7/04; C08L71/12; C08L79/08; C08L81/06; H01B3/42; H01B3/44
Attorney, Agent or Firm:
Kubota Chikashi (1 person outside)