PURPOSE: To obtain a polymer composition suitable for IC board, etc., having excellent heat resistance, electrical insulating properties, dielectric characteristics, etc., having improved recycle molding, comprising a specific polyetherimide, a prescribed polyphenylene ether and a specific epoxy modified styrenic copolymer.

CONSTITUTION: This composition comprises (A) a polyether imide of formula I (n is 1-100; R1 is group of formula II, formula III, etc.; R2 is group of formula IV, formula V, etc.), (B) a polyphenylene ether of formula VI (Y1 to Y4 are H or methyl) and (C) 0.1-1.0 pt.wt. of an epoxy modified styrenic copolymer based on 100 pts.wt. of total of the components A and B. The component C is preferably a graft copolymer and the composition is preferably further mixed with (D) a silane-based coupling agent and (E) a filler (e.g. whisker or inorganic filler in single fiber state).