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Title:
POLYMER COMPOSITION FOR THICKENING RESIST PATTERN, AND METHOD FOR FORMING RESIST PATTERN
Document Type and Number:
Japanese Patent JP2018005199
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a material and a method for achieving a finer pattern of various shapes.SOLUTION: The method for forming a resist pattern comprises: a step of forming a resist prepattern 2 having a polar group exposed on a surface 2a thereof on a support body 1; a step of forming a polymer film 3 by applying a polymer composition for thickening a resist pattern on the support 1 where the resist prepattern 2 is formed so as to cover the resist prepattern 2; a step of forming a developer-insoluble layer 3a on the surface 2a; a step of forming a resist pattern 4 obtained by thickening the resist prepattern 2 by developing the resist prepattern 2 having the developer-insoluble layer 3a formed thereon and the polymer film 3 covering the same. The polymer composition for thickening a resist pattern comprises: a polymer compound having a structural unit having a function of thickening the resist prepattern 2; and a polymer compound having a structural unit including a neutralizing group that can neutralize the polar group exposed on the surface 2a.SELECTED DRAWING: Figure 1

Inventors:
MORI YOSHITAKA
HORI YOICHI
SUNAMICHI TOMONARI
Application Number:
JP2016136356A
Publication Date:
January 11, 2018
Filing Date:
July 08, 2016
Export Citation:
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Assignee:
TOKYO OHKA KOGYO CO LTD
International Classes:
G03F7/40; C08F246/00; G03F7/038; G03F7/039; G03F7/20
Attorney, Agent or Firm:
Sumio Tanai
Masatake Shiga
Matsumoto
Ryu Miyamoto
Masato Iida