Title:
ポリマー組成物
Document Type and Number:
Japanese Patent JP5886134
Kind Code:
B2
Abstract:
The present invention provides a polymer composition having a low water absorption (i.e. being dampproof), excellent electrical insulation, high adhesion to various substrates, and excellent thermal stability. The present invention relates to a polymer composition comprising (A) a dimer acid-based polyamide and (B) an olefin-based-modified polymer, wherein the olefin-based-modified polymer (B) comprises a chemical structure derived from an olefin and a chemical structure derived from an amide.
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Inventors:
Yukio Isobe
Application Number:
JP2012120291A
Publication Date:
March 16, 2016
Filing Date:
May 25, 2012
Export Citation:
Assignee:
Henkel Japan Ltd.
International Classes:
C08L77/00; C08L23/36; C09J123/00; C09J151/06; C09J177/08
Domestic Patent References:
| JP2003268342A | ||||
| JP8000344A | ||||
| JP2001270987A | ||||
| JP2011519176A | ||||
| JP9111215A |
Foreign References:
| US5506298 |
Attorney, Agent or Firm:
Katsuhiro Ito
Akiko Ono
Akiko Ono