Title:
POLYMER COMPOUND FOR PHOTORESIST AND RESIN COMPOSITION FOR PHOTORESIST
Document Type and Number:
Japanese Patent JP2002241442
Kind Code:
A
Abstract:
To obtain a resin for photoresist capable of giving a fine pattern having high resolution excellent in homogeneity.
In the resin for photoresist there is used a compound represented by general formulas (1a) and (1b) (wherein, R1 is a hydrogen atom or a methyl group; Ra and Rb are each a 1-8C hydrocarbon group which may be the same or different; Rc, Rd and Re are each a hydrogen atom or a methyl group which may be the same or different; Xa, Xb and Xc are each -CH2- or -CO-O- which may be the same or different, provided at least one of Xa, Xb and Xc is -CO-O-) as a monomer.
Inventors:
TSUTSUMI KIYOHARU
ITOKAZU TERUO
ITOKAZU TERUO
Application Number:
JP2001043161A
Publication Date:
August 28, 2002
Filing Date:
February 20, 2001
Export Citation:
Assignee:
DAICEL CHEM
International Classes:
G03F7/039; C08F220/26; C08F222/06; C08F232/00; C08K5/00; C08L33/14; C08L35/00; C08L45/00; (IPC1-7): C08F220/26; C08F222/06; C08F232/00; C08K5/00; C08L33/14; C08L35/00; C08L45/00