Title:
重合体、エポキシ樹脂組成物、エポキシ樹脂硬化物及び電子部品装置
Document Type and Number:
Japanese Patent JP7320224
Kind Code:
B2
Abstract:
To provide an epoxy resin composition excellent in heat resistance.SOLUTION: The epoxy resin composition comprises a polymer including a structural unit represented by the general formula (I), and an epoxy resin. In the general formula (I), X represents a divalent hydrocarbon group; and the symbol * represents a binding site to a neighboring structural unit.SELECTED DRAWING: None
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Inventors:
Tomoya Masuda
Hiroto Kudo
Shinya Nakamura
Hiroto Kudo
Shinya Nakamura
Application Number:
JP2019076374A
Publication Date:
August 03, 2023
Filing Date:
April 12, 2019
Export Citation:
Assignee:
Resonac Co., Ltd.
Kansai University
Kansai University
International Classes:
C08L39/04; C08L63/00
Domestic Patent References:
| JP2019500443A | ||||
| JP2013511614A | ||||
| JP2018509493A | ||||
| JP2001026720A | ||||
| JP8283686A | ||||
| JP62000552A |
Attorney, Agent or Firm:
Patent Attorney Corporation Taiyo International Patent Office
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