POLYMER FOR FORMING CAVITY BETWEEN MULTILAYERED WIRINGS AND ITS MANUFACTURING METHOD

Title:

POLYMER FOR FORMING CAVITY BETWEEN MULTILAYERED WIRINGS AND ITS MANUFACTURING METHOD

Document Type and Number:

Japanese Patent JP2004149607

Kind Code:

A

Abstract:

To obtain a polymer capable of easily forming a cavity structure between metal wirings in a semiconductor device, and the like, and to provide a method for forming the cavity between the metal wirings using the polymer.

The polymer for forming the cavity between the multilayered wirings is a cyclic olefin addition polymer and has a number-average molecular weight within the range of 10,000-300,000 in terms of polystyrene. The method for forming the cavity between the multilayered wirings comprises using this polymer.

Inventors:

KUROSAWA TAKAHIKO
SHIRATO KAORI
MARUYAMA YOICHIRO

Application Number:

JP2002314225A

Publication Date:

May 27, 2004

Filing Date:

October 29, 2002

Export Citation:

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Assignee:

JSR CORP

International Classes:

C08G61/06; C09D165/00; H01L21/312; C08F32/00; H01L21/768; H01L23/522; (IPC1-7): C08F32/00; H01L21/768

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