Title:
POLYMER, HARDMASK COMPOSITION, AND METHOD OF FORMING PATTERNS
Document Type and Number:
Japanese Patent JP2020105513
Kind Code:
A
Abstract:
To simultaneously secure the solubility of a polymer and the etch resistance and heat resistance of a hardmask layer using the polymer.SOLUTION: A polymer includes structural units obtained by a reaction of a reaction mixture that includes an indole or a derivative thereof, a first aromatic aldehyde compound including a substituted or unsubstituted C3 to C20 branched alkyl group, and a second aromatic aldehyde compound that is different from the first aromatic aldehyde compound. Also provided are a hardmask composition comprising the polymer, and a method of forming patterns using the hardmask composition.SELECTED DRAWING: None
Inventors:
PARK SOYEON
KIM YOUNG MIN
YOO YONG-SIK
KIM YOUNG MIN
YOO YONG-SIK
Application Number:
JP2019235032A
Publication Date:
July 09, 2020
Filing Date:
December 25, 2019
Export Citation:
Assignee:
SAMSUNG SDI CO LTD
International Classes:
C08G12/26; C08L61/26; G03F7/11; G03F7/20
Domestic Patent References:
| JP2020503395A | 2020-01-30 | |||
| JP2016151024A | 2016-08-22 | |||
| JP6094767B2 | 2017-03-15 |
Foreign References:
| WO2018131562A1 | 2018-07-19 |
Attorney, Agent or Firm:
Hatta International Patent Corporation