Title:
POLYMER, POLYMER SOLUTION, PHOTOSENSITIVE RESIN COMPOSITION, AND CURED PRODUCT
Document Type and Number:
Japanese Patent JP2023091438
Kind Code:
A
Abstract:
To provide a polymer that has improved heat properties, resulting in excellent processability and patternability in photolithography, well-balanced sensitivity, alkali solubility and thermal yellowing resistance, as well as superior cured resin sensitivity.SOLUTION: A polymer comprises structural units represented by a predetermined formula (NB) and a predetermined formula (AK), and structural units represented by a predetermined formula (1), illustrated below, or a predetermined formula (2). In the formula (1), Rp is a group having two or more (meth)acryloyl groups, and R21 and R22 independently represent a hydrogen atom or a C1-3 organic group.SELECTED DRAWING: None
Inventors:
TANABE JUNICHI
Application Number:
JP2021206186A
Publication Date:
June 30, 2023
Filing Date:
December 20, 2021
Export Citation:
Assignee:
SUMITOMO BAKELITE CO
International Classes:
C08F8/14; C08F8/12; C08F222/04; C08F232/00; C08F290/12; G02B5/20; G03F7/004; G03F7/033
Attorney, Agent or Firm:
Shinji Hayami