To provide a polymerizable composition useful for producing a laminate having extremely small dielectric loss tangent in high frequency region, excellent in heat resistance and peel strength, and small in warpage; a resin molding obtained using the polymerizable composition; and a laminate formed by laminating the resin molding.

This polymerizable composition includes a cycloolefin monomer, a polymerization catalyst, a crosslinking agent, a crosslinking auxiliary agent and a reactive fluidizer, where the cycloolefin monomer contains a cycloolefin monomer having a (meth)acryloyl group and a cycloolefin monomer not having the (meth)acryloyl group in a weight ratio (cycloolefin monomer having a (meth)acryloyl group: cycloolefin monomer not having the (meth)acryloyl group) within a range of 1:99 to 30:70; and the reactive fluidizer has 1-20 pts.wt. monofunctional compound having one vinylidene group and 0.1-20 pts.wt. difunctional compound having two vinylidene groups each based on 100 pts.wt. of the cycloolefin monomer.