Title:
POLYMERIZABLE RESIN COMPOSITION AND ARTICLE WITH CURED FILM FORMED THEREFROM
Document Type and Number:
Japanese Patent JP3468311
Kind Code:
B2
Abstract:
PURPOSE: To obtain a polymerizable resin compsn. which gives a film excellent in adhesive properties, abrasion resistance, and flexibility.
CONSTITUTION: This compsn. is a photopolymerizable resin compsn. comprising a compd. (A) obtd. by reacting a compd. having at least one isocyanate group per molecule with a hydroxyl compd. having at least two ethylenical double bonds per molecule, a compd. (B) having at least one double bond per molecule except compd. A, and a photostabilizer and/or an ultraviolet absorber.
Inventors:
Koji Isobe
Ritsuko Yoshioka
Morio Wada
Ritsuko Yoshioka
Morio Wada
Application Number:
JP13788494A
Publication Date:
November 17, 2003
Filing Date:
May 30, 1994
Export Citation:
Assignee:
NIPPON KAYAKU KABUSHIKI KAISHA
International Classes:
C08J7/04; B32B27/18; C08F2/46; C08F290/00; C08F290/06; C09D4/00; C09D5/00; (IPC1-7): C08F2/46; C08F290/06; C09D5/00
Domestic Patent References:
| JP2178359A | ||||
| JP1174515A | ||||
| JP586152A | ||||
| JP5951908A | ||||
| JP4168161A | ||||
| JP4173822A |
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