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Title:
POLYOLEFIN COMPOSITION
Document Type and Number:
Japanese Patent JP2000087002
Kind Code:
A
Abstract:

To obtain a polyolefin composition having excellent bondability.

This composition is the one which has improved bondability and comprises (A) a polyolefin containing repeating units derived from at least one olefin and in which each molecule contains at least two ethylenic unsaturations capable of curing the polyolefin by reaction; and 1-10 wt.%, based on the polyolefin composition, (B) an adhesion accelerator for the polyolefin and in which the adhesion accelerator contains at least one organosilicon compound containing at least one Si-bonded alkenyl and at least one Si-bonded moisture-reactive group.


Inventors:
FENG QIAN JANE
KALINOWSKI ROBERT EDWARD
LEE KENNETH MICHAEL
LUTZ MICHAEL ANDREW
OWEN MICHAEL JAMES
PERZ SUSAN VICTORIA
SUZUKI TOSHIO
Application Number:
JP24152799A
Publication Date:
March 28, 2000
Filing Date:
August 27, 1999
Export Citation:
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Assignee:
DOW CORNING
International Classes:
C08G77/442; C08J5/12; C08K5/5425; C08L23/22; C08L83/04; C09J123/26; C08J3/24; C09J183/04; C08L43/04; (IPC1-7): C09J183/04; C08G77/442; C08J3/24; C08J5/12; C08L23/22; C08L83/04; C09J123/26
Attorney, Agent or Firm:
Takashi Ishida (4 others)