Title:
改良された加工安定性および低い放出傾向を備えた成形用ポリオキシメチレン組成物
Document Type and Number:
Japanese Patent JP5468295
Kind Code:
B2
Abstract:
Moulding materials made of linear polyoxymethylene copolymers with essentially oxymethylene units and oxyethylene units as structural units in the polymer chain, whereby the proportion of oxyethylene units in the structural units of the polymer chain amounts to 1.5 - 2.5 mol %. The inventive moulding materials and moulded articles produced therefrom and optionally coloured exhibit high stability and emit extremely low quantities of formaldehyde and residual monomers. At the same time mechanical properties are high, so that the usual fields of application and processing methods can be utilized without any restrictions.
Inventors:
Dish, stephan
Ekart, peter
Mucc, Karl-Friedrich
Royshell, Gerhard
Riceman, roth al
Ekart, peter
Mucc, Karl-Friedrich
Royshell, Gerhard
Riceman, roth al
Application Number:
JP2009111098A
Publication Date:
April 09, 2014
Filing Date:
April 30, 2009
Export Citation:
Assignee:
Ticona GmbH
International Classes:
C08L59/00; C08F8/04; C08L59/04; C08G2/10; C08G2/18; C08G4/00; C08G65/08; C08G65/10; C08G65/16; C08J5/18
Domestic Patent References:
| JP7179722A | ||||
| JP63125511A | ||||
| JP57012018A | ||||
| JP9077838A | ||||
| JP60063216A | ||||
| JP8231665A | ||||
| JP55019942B1 | ||||
| JP2002511506A | ||||
| JP5186663A |
Attorney, Agent or Firm:
Shinjiro Ono
Kazuo Shamoto
Yasushi Kobayashi
Akio Chiba
Hiroyuki Tomita
Kazuo Shamoto
Yasushi Kobayashi
Akio Chiba
Hiroyuki Tomita
Previous Patent: JPS5468294
Next Patent: METHOD AND APPARATUS FOR MEASURING DYNAMIC PROPERTIES OF PACKED LAYER
Next Patent: METHOD AND APPARATUS FOR MEASURING DYNAMIC PROPERTIES OF PACKED LAYER