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Title:
POLYOXYMETHYLENE MOLDING COMPOUND AND MOLDED BODY PRODUCED THEREFROM
Document Type and Number:
Japanese Patent JP2009167426
Kind Code:
A
Abstract:

To provide a polyacetal molding material having very low polyacetal decomposition level, comparatively high heat stability and aging resistance, a low formaldehyde emission level, comparatively high strength and impact strength, high tensile strain at break and high weld line strength, and excellent stability on contact with fluid.

The polyacetal molding material contains a polyacetal homopolymer/copolymer, an additive, and a 0.0001-1.0 wt.% of a substance catalyzing a chemical reaction between the polyacetal matrix polymer and the surface of the additive. The substance contains no boron element and is not a Bronsted acid.


Inventors:
PAPKE NICOLAI
Application Number:
JP2009111103A
Publication Date:
July 30, 2009
Filing Date:
April 30, 2009
Export Citation:
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Assignee:
TICONA GMBH
International Classes:
C08L59/00; C08K3/00; C08K5/00; C08K7/02; C08K7/14
Domestic Patent References:
JPH09176443A1997-07-08
JPS59179538A1984-10-12
JPS492974A1974-01-11
JPS60219252A1985-11-01
JPS6291551A1987-04-27
JPS58109551A1983-06-29
JPS6333466A1988-02-13
JPH0570624A1993-03-23
JPH06345939A1994-12-20
JP2005519162A2005-06-30
Attorney, Agent or Firm:
Shinjiro Ono
Kazuo Shamoto
Yasushi Kobayashi
Akio Chiba
Hiroyuki Tomita