Title:
POLYOXYMETHYLENE RESIN COMPOSITION AND MOLDED ARTICLE THEREOF
Document Type and Number:
Japanese Patent JP2008163170
Kind Code:
A
Abstract:
To provide a polyoxymethylene resin composition excellent in transparency and stiffness and to provide a molded article thereof.
The invention relates to the resin composition comprising the polyoxymethylene resin and benzylidene sorbitol compounds, wherein the resin temperature in thermally plasticizing the composition for molding, is set at a temperature higher than the melting temperature of the polyoxymethylene and equal to or higher than [(the melting temperature of the benzylidene sorbitol compounds) -50C].
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Inventors:
OKAMURA AKIRA
NAGAI SATOSHI
NAGAI SATOSHI
Application Number:
JP2006353770A
Publication Date:
July 17, 2008
Filing Date:
December 28, 2006
Export Citation:
Assignee:
MITSUBISHI GAS CHEMICAL CO
International Classes:
C08L59/00; C08J5/00; C08K5/1575
Attorney, Agent or Firm:
Takashi Nagai