Title:
Polyoxymethylene resin composition and molded article containing it
Document Type and Number:
Japanese Patent JP6357238
Kind Code:
B2
Abstract:
Disclosed are a polyoxymethylene resin composition and a molded product including the same, wherein the polyoxymethylene resin composition includes a polyoxymethylene resin; and, based on 100 parts by weight of the polyoxymethylene resin, 0.01 to 0.5 parts by weight of alkaline earth metal hydroxide, 0.01 to 1 parts by weight of porous organic/inorganic hybrid silicate, 0.01 to 1 parts by weight of LDPE (Low Density Polyethylene), and 0.02 to 0.5 parts by weight of polyhydric alcohol fatty acid ester, thereby exhibiting improved thermal stability and mold deposit resistance of a molded product while retaining the inherent properties of polyoxymethylene resin, such as mechanical strength and impact resistance.
Inventors:
Kang Min
Shin, Bumshik
Park, Eunha
Shin, Bumshik
Park, Eunha
Application Number:
JP2016544158A
Publication Date:
July 11, 2018
Filing Date:
December 31, 2014
Export Citation:
Assignee:
Kolon Plastics, Inc.
International Classes:
C08K3/22; C08L59/00; C08K5/103; C08L23/06; C08L83/04
Domestic Patent References:
| JP2001142176A | ||||
| JP2009082786A | ||||
| JP2010270203A | ||||
| JP10237268A | ||||
| JP2008527131A |
Foreign References:
| WO1998021280A1 |
Attorney, Agent or Firm:
Yamashita
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