Title:
ポリオキシメチレン樹脂組成物及び成形体
Document Type and Number:
Japanese Patent JP6943806
Kind Code:
B2
Abstract:
The present invention relates to a polyoxymethylene resin composition and a molded body. The present invention provides a polyoxymethylene resin composition and a molded body that have a small changein Charpy impact strength and are also excellent in high-temperature low-stress creep characteristics. The polyoxymethylene resin composition is characterized in that the polyoxymethylene resin composition contains: 100 parts by mass of a polyoxymethylene resin homopolymer (A), 0.05 mass parts or more and 0.05 mass parts or less polyamide polymer (B) having a melting point of 140 DEG C or higher and 200 DEG C or lower, and boron nitride (C) of 0.05 mass part or more and 0.05 mass part or less, and the mass ratio of the (B) polyamide polymer to the (C) boron nitride is (B) polyamide polymer/(C)boron nitride =95/5 or more and 70/30 or less. The molded body is characterized in that the molded body includes the polyoxymethylene resin composition.
Inventors:
Yuji Yoshinaga
Tadashi Yamamoto
Tadashi Yamamoto
Application Number:
JP2018079095A
Publication Date:
October 06, 2021
Filing Date:
April 17, 2018
Export Citation:
Assignee:
ASAHI KASEI KABUSHIKI KAISHA
International Classes:
C08K3/38; C08L59/02; C08L33/26; C08L77/00
Domestic Patent References:
| JP2018504499A | ||||
| JP2008291073A | ||||
| JP9235409A | ||||
| JP2011246566A |
Foreign References:
| US6590020 |
Attorney, Agent or Firm:
Kenji Sugimura
Mitsutsugu Sugimura
Koichiro God
Mitsutsugu Sugimura
Koichiro God