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Patent Searching and Data


Title:
POLYOXYMETHYLENE RESIN COMPOSITION AND MOLDED PRODUCT
Document Type and Number:
Japanese Patent JP2018131568
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a polyoxymethylene resin composition which has excellent weather-resistant stability and reduces a formaldehyde emission amount and also reduces a formaldehyde emission amount during molding residence.SOLUTION: There is provided a polyoxymethylene resin composition which comprises 100 pts.mass of a polyoxymethylene resin homopolymer (A), 0.05 to 0.5 pt.mass of a nitrogen-containing compound having formaldehyde capturing performance (B), 0.1 to 0.5 pt.mass of an ultraviolet absorber (C), 0.1 to 0.5 pt.mass of a hindered amine-based light stabilizer (D), 0.01 to 0.05 pt.mass of an antioxidant (E), 0.01 to 0.1 pt.mass of a lubricant (F) and 0.1 to 1.0 pt.mass of a polyolefin resin (G), wherein the mass ratio between the lubricant (F) and the polyolefin resin (G) is 5/95 to 30/70.SELECTED DRAWING: None

Inventors:
YOSHINAGA YUJI
SASAKI YUKIYOSHI
Application Number:
JP2017027216A
Publication Date:
August 23, 2018
Filing Date:
February 16, 2017
Export Citation:
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Assignee:
ASAHI KASEI CORP
International Classes:
C08L59/02; C08K3/08; C08L23/02
Attorney, Agent or Firm:
Yoshiyuki Inaba
Toshifumi Onuki
Akihiko Eguchi
Kazuhiko Naito