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Patent Searching and Data


Title:
POLYOXYMETHYLENE RESIN COMPOSITION AND MOLDED PRODUCT THEREOF
Document Type and Number:
Japanese Patent JP3821698
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To provide a polyoxymethylene resin composition having very excellent impact resistance as well as the heat stability of a polyoxymethylene resin and having antistatic performances.
SOLUTION: This composition comprises 40-99.5 pts.wt. (A) polyoxymethylene resin and 0.5-60 pts.wt. resin comprising (B) a polyamide elastomer and (C) an acid-modified olefin resin having an acid modification rate of 0.05-15 wt.% and having a ratio (B)/(C) of 10/90 to 90/10 wt.%.


Inventors:
Shuichi Kudo
Morihiro Horio
Application Number:
JP2001377289A
Publication Date:
September 13, 2006
Filing Date:
December 11, 2001
Export Citation:
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Assignee:
Asahi Kasei Chemicals Corporation
International Classes:
C08J5/00; C08L59/00; C08K3/00; C08K5/00; (IPC1-7): C08L59/00; C08J5/00; C08K3/00; C08K5/00; //(C08L59/00; C08L77:00; C08L23:26)
Domestic Patent References:
JP10130458A
JP8012848A
JP7207115A
JP7188475A
JP4168145A
JP1146947A
Attorney, Agent or Firm:
Hideo Takei
Takeshi Shimizu
Joi Ito
Yoshio Narui