Title:
POLYOXYMETHYLENE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2004026858
Kind Code:
A
Abstract:
To provide a polyoxymethylene resin composition having excellent heat stability capable of withstanding high temperature and long-term molding.
The polyoxymethylene resin composition is obtained by adding a phosphorus-containing compound represented by formula (I) or (II) (wherein R1, R2, and R3 are each a hydrocarbon group; M1 and M2 are each a metal; and n1 and n2 are each an integer of 1-3 showing the valence of M1 and M2).
Inventors:
ITO GENMEI
TOGAWA MITSUNARI
NISHIMURA TORU
TOGAWA MITSUNARI
NISHIMURA TORU
Application Number:
JP2002180841A
Publication Date:
January 29, 2004
Filing Date:
June 21, 2002
Export Citation:
Assignee:
TORAY INDUSTRIES
International Classes:
C08L59/00; C08K5/13; C08K5/3435; C08K5/521; C08K5/527; (IPC1-7): C08L59/00; C08K5/13; C08K5/3435; C08K5/521; C08K5/527