Title:
POLYOXYMETHYLENE RESIN MATERIAL FOR MOLDING
Document Type and Number:
Japanese Patent JP3706251
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a polyoxymethylene resin material for molding that has improved molding characteristics, particularly in liberation of formaldehyde gas on the molding, occurrence of mold deposit, discoloration of molded products and the like.
SOLUTION: This resin material is prepared by formulating (a) 0.01 3 pts.wt. of a sterically hindered phenolic antioxidant and (b) 0.0001-0.1 pt.wt. of an ionic salt of an α-olefin and α,β-ethylenically unsaturated carboxylic acid copolymer to 100 pts.wt. of polyoxymethylene and the content of the formal-dehyde extractable with hot water is ≤100 ppm.
Inventors:
Ninokura Hideki
Noriyuki Sugiyama
Noriyuki Sugiyama
Application Number:
JP18412998A
Publication Date:
October 12, 2005
Filing Date:
June 30, 1998
Export Citation:
Assignee:
Polyplastics Co., Ltd.
International Classes:
C08K5/13; C08L59/00; (IPC1-7): C08L59/00; C08K5/13
Domestic Patent References:
| JP62212452A | ||||
| JP2000017144A | ||||
| JP9278983A | ||||
| JP61145245A |
Other References:
松島哲也,プラスチック材料講座(13)ポリアセタール樹脂,日本,日刊工業新聞社,1970年 6月30日,初版,p.77
Attorney, Agent or Firm:
Satoshi Furuya
Kaoru Furuya
Takahiko Mizobe
Shinji Mochida
Kaoru Furuya
Takahiko Mizobe
Shinji Mochida