Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
POLYPHENYLENE SULFIDE RESIN COMPOSITION AND MOLDED PRODUCT THEREOF
Document Type and Number:
Japanese Patent JP2000086892
Kind Code:
A
Abstract:

To obtain a composition capable of giving a cured product having high adhesive strength to an epoxy resin and a small dispersion of such strength by selecting a composition comprising a polyphenylene sulfide resin, a glass fiber and a filler except a glass fiber and having a specified or larger spiral flow length and a specified heating loss.

This composition is one comprising 100 pts.wt. polyphenylene sulfide resin, 5-300 pts.wt. coupling-agent-treated glass fiber having an average fiber diameter of 3-15 μm, and 5-300 pts.wt. inorganic filler (e.g. talc or mica) except a glass fiber and having a spiral flow length of 120 mm or above and a heating loss of 0.3-2.0 wt.%. If necessary, it may further be formulated with 0-50 pts.wt. thermoplastic resin having ester linkages, ether linkages, amino linkages, or the like and the like. The polyphenylene sulfide resin is a mixture comprising 10-100 wt.% one having a content of chloroform extractibles of 1.0 wt.% and an MFR of 1,000 g/10 min and 0-90 wt.% one having a content of chloroform extractibles of 0.3 wt.% or below and an MFR of 250 g/10 min or above.


Inventors:
SUZUKI SHIGEMITSU
KOMINAMI KAZUHIKO
KOBAYASHI HIROKAZU
Application Number:
JP25581998A
Publication Date:
March 28, 2000
Filing Date:
September 09, 1998
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
TORAY INDUSTRIES
International Classes:
C08K3/00; C08K7/14; C08L81/02; C08L81/04; (IPC1-7): C08L81/04; C08K3/00; C08K7/14; C08L81/02