POLYPROPYLENE RESIN COMPOSITION FOR INFLATION MOLDING AND FILM OF THE SAME

Title:

POLYPROPYLENE RESIN COMPOSITION FOR INFLATION MOLDING AND FILM OF THE SAME

Document Type and Number:

Japanese Patent JP2004099710

Kind Code:

A

Abstract:

To provide a polypropylene resin composition for inflation molding and a film of the same excellent in the bubble stability during inflation molding and in which neither uneven thickness nor uneven transparency occurs.

The polypropylene resin composition for inflation molding comprises 50-99.9 pts. wt. of a propylene polymer (A) with a melt tension ratio at 190°C of 1.2 or less and 0.01-50 pts. wt. of a propylene polymer (B) with a melt tension ratio at 190°C of 1.6 or more, and has a die swell ratio at 230°C of 1.2 to less than 1.6, wherein the sum of the propylene polymer (A) and the propylene polymer (B) is 100 pts. wt.. The film is composed of the polypropylene resin composition.

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Inventors:

NOZAWA HIROSHI
SHIRATANI EISUKE

Application Number:

JP2002262470A

Publication Date:

April 02, 2004

Filing Date:

September 09, 2002

Export Citation:

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Assignee:

SUMITOMO CHEMICAL CO

International Classes:

C08J5/18; B29C55/28; C08L23/10; B29K23/00; (IPC1-7): C08L23/10; B29C55/28; C08J5/18

Attorney, Agent or Firm:

Takashi Kuboyama
Toru Nakayama
Masayuki Enomoto

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