Title:
ポリプロピレン樹脂コンパウンド
Document Type and Number:
Japanese Patent JP7023602
Kind Code:
B2
Abstract:
A compound containing: 10-50% by weight of a polypropylene composition comprising (A1-1) and (A1-2) (where (A1-1) is 60-85% by weight of polypropylene and (A1-2) is 15-40% by weight of propylene-ethylene copolymer containing 25-50% by weight of units derived from ethylene) as component (A1); 0-50% by weight of polypropylene as component (A2); 2-15% by weight of modified polypropylene as component (A3); 15-25% by weight of a plate-form inorganic filler as component (B); 5-20% by weight of a fibrous inorganic filler as component (C); and 0.1-3 parts by weight, with respect to 100 total parts by weight of the above (A1)-(C), of a nucleating agent including an organic nucleating agent as component (D), wherein the melt flow rate (230°C, 21.18 N load) of the compound is 3-15 g/10 min. This polypropylene resin compound has high rigidity.
Inventors:
Yasumoto Kazutoshi
Wakako Kamimura
Wakako Kamimura
Application Number:
JP2016253745A
Publication Date:
February 22, 2022
Filing Date:
December 27, 2016
Export Citation:
Assignee:
SunAllomer Ltd.
International Classes:
C08L23/12; C08J5/00; C08K7/00; C08K7/04; C08L23/16; C08L23/26
Domestic Patent References:
| JP2011256247A | ||||
| JP2012158648A | ||||
| JP11021391A | ||||
| JP7173342A |
Attorney, Agent or Firm:
Shinjiro Ono
Kobayashi Yasushi
Takeuchi Shigeo
Osamu Yamamoto
Minako Matsuyama
Ken Matsumoto
Noriyuki Arai
Kobayashi Yasushi
Takeuchi Shigeo
Osamu Yamamoto
Minako Matsuyama
Ken Matsumoto
Noriyuki Arai
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