Title:
ポリプロピレン系樹脂発泡粒子
Document Type and Number:
Japanese Patent JP6637903
Kind Code:
B2
Abstract:
With use of expanded polypropylene resin particles having, as a base material resin, a polypropylene resin composition X containing a polypropylene resin A having a low melting point, a polypropylene resin B having a high melting point, and a polyethylene resin C having a specific melting point, wherein the polypropylene resin A, the polypropylene resin B, and the polyethylene resin C are present in respective predetermined amounts, a polypropylene resin in-mold expanded molded product having a high compressive strength and an excellent appearance is produced at a decreased molding temperature during in-mold foaming molding.
Inventors:
Shintaro Miura
Application Number:
JP2016564828A
Publication Date:
January 29, 2020
Filing Date:
December 11, 2015
Export Citation:
Assignee:
Kaneka Corporation
International Classes:
C08J9/18
Domestic Patent References:
| JP2014173012A | ||||
| JP2009051035A1 | ||||
| JP2010144078A | ||||
| JP2006054727A1 | ||||
| JP8183873A |
Other References:
製品紹介・樹脂解説:日本ポリエチレン株式会社,日本,日本ポリエチレン株式会社,2019年 9月 4日,ノバテックHD,ノバテックLL,インターネット:www.pochem.co.jp/jpe/product/kaisetsu.html
Attorney, Agent or Firm:
Harakenzo world patent & trademark