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Title:
POLYSTYRENE-BASED RESIN AND ITS FOAM
Document Type and Number:
Japanese Patent JP3271753
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To obtain the subject resin excellent in mechanical strength, injection molding properties, extrusion molding properties, etc., by polymerizing an aromatic vinyl-based compound, etc., until a specific conversion in the presence of a specific polymerization initiator to specify the weight-average molecular weight, etc.
SOLUTION: A mixture of (A) an aromatic vinyl-based compound (e.g. styrene) with (B) as necessary, a compound copolymerizable with the component A is (co)polymerized so that final polymerization conversion becomes ≥76% in the presence of a polymerization initiator comprising (C) an organic peroxide of the formula (R1 and R2 are each H or a 1-2C alkyl; R3 is a 1-5C alkyl or phenyl) [e.g. 2,2-bis(4,4-ditertiary butylperoxycyclohexyl)propane] to provide the objective resin in which a ratio (Mz/Mw) of Z average molecular weight (Mz) to weight average molecular weight (Mw) is 1.7-2.5 and a ratio (Mw/Mn) of Mw to number-average molecular weight (Mn) is 2.0-3.0 and Mw is 200,000 to 600,000.


Inventors:
Hideki Watanabe
Sadao Kawamura
Tetsuya Takahashi
Application Number:
JP32351798A
Publication Date:
April 08, 2002
Filing Date:
November 13, 1998
Export Citation:
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Assignee:
DENKI KAGAKU KOGYO KABUSHIKI KAISHA
International Classes:
C08J9/228; B29C44/00; B29C45/00; B29C47/00; C08F4/36; C08F12/00; C08F12/08; B29K25/00; (IPC1-7): C08J9/228; C08F4/36; C08F12/00
Other References:
【文献】欧州特許出願公開501288(EP,A1)
Attorney, Agent or Firm:
Kanaya Yutaka