Title:
ポリウレタン研磨パッド
Document Type and Number:
Japanese Patent JP5593337
Kind Code:
B2
Abstract:
The polishing pad is suitable for planarizing at least one of semiconductor, optical and magnetic substrates. The polishing pad includes a cast polyurethane polymeric material formed with an isocyanate-terminated reaction product formed from a prepolymer reaction of a prepolymer polyol and a polyfunctional isocyanate. The isocyanate-terminated reaction product has 4.5 to 8.7 weight percent unreacted NCO; and the isocyanate-terminated reaction product is cured with a curative agent selected from the group comprising curative polyamines, curative polyols, curative alcoholamines and mixtures thereof. The polishing pad contains at least 0.1 volume percent filler or porosity.
Inventors:
Culp, Mary Joe
Application Number:
JP2012009792A
Publication Date:
September 24, 2014
Filing Date:
January 20, 2012
Export Citation:
Assignee:
Rohm and Haas Electronic マテリアルズ CMP Holdings, Incorporated
International Classes:
B24B37/24; B24B37/04; C08G18/10; C08G18/48; C08G18/66; C08G18/76; C08J9/32; H01L21/304
Attorney, Agent or Firm:
Hajime Tsukuni