Title:
PORE GENERATING TYPE RESINOID GRINDING WHEEL
Document Type and Number:
Japanese Patent JP2005319556
Kind Code:
A
Abstract:
To provide a pore generating type resinoid grinding wheel advantageously usable for grinding a workpiece such as a silicon wafer requiring high machining accuracy while suppressing swelling by water absorption of a pore generating agent.
This pore generating type resinoid grinding wheel contains an abrasive material and an inorganic solid bound by an inorganic binder, wherein the inorganic solid is formed as a granulating body of fine grains, and coating treatment is applied to the outer periphery of the fine grain granulating body. Preferably, coating treatment is applied also to the side face of a grinding wheel polishing surface.
Inventors:
ARAKANE NOBUYUKI
KASHIKI JUNJI
KASHIKI JUNJI
Application Number:
JP2004141071A
Publication Date:
November 17, 2005
Filing Date:
May 11, 2004
Export Citation:
Assignee:
KURENOOTON KK
International Classes:
B24D3/32; B24D3/02; B24D7/00; (IPC1-7): B24D3/32; B24D3/02; B24D7/00
Attorney, Agent or Firm:
Atsushi Aoki
Takashi Ishida
Tetsuji Koga
Masaya Nishiyama
Takashi Ishida
Tetsuji Koga
Masaya Nishiyama