Title:
研磨パッドを形成するための気孔率制御方法
Document Type and Number:
Japanese Patent JP6870927
Kind Code:
B2
Abstract:
The invention is to a method of manufacturing a polishing pad suitable for planarizing at least one of semiconductor, optical and magnetic substrates. The method includes applying droplets of a liquid polymer against a substrate to form a plurality of pores. The liquid polymer contains a nonionic surfactant, the nonionic surfactant has a concentration sufficient to facilitate growth of pores within the liquid polymer and an ionic surfactant has a concentration sufficient to limit growth of the pores within the liquid polymer. Curing the solid polymer forms a polishing pad with final size of the plurality of pores controlled by the concentration of nonionic surfactant and ionic surfactants.
Inventors:
Yufa Tong
Andrew Wank
Diego Lugo
Mark Earl Stack
David Michael Venice
Marty Digrut
George Sea Jacob
Jeffrey Bee Miller
Andrew Wank
Diego Lugo
Mark Earl Stack
David Michael Venice
Marty Digrut
George Sea Jacob
Jeffrey Bee Miller
Application Number:
JP2016125337A
Publication Date:
May 12, 2021
Filing Date:
June 24, 2016
Export Citation:
Assignee:
Rohm and Haas Electronic Materials CMP Housings, Inc.
Dow Global Technologies LLC
Dow Global Technologies LLC
International Classes:
B24B37/24; H01L21/304
Domestic Patent References:
| JP2013515379A | ||||
| JP2009514690A | ||||
| JP2013023691A | ||||
| JP2009018374A | ||||
| JP2008238323A | ||||
| JP2013211549A |
Foreign References:
| US20130012108 | ||||
| WO2015065793A1 | ||||
| US20060052040 | ||||
| US20010046834 |
Attorney, Agent or Firm:
Patent business corporation Tsukuni