To provide a porous material that is preferably formed of a porous layer that can be formed by self-organization on a part to be exposed to high temperature in a substrate to be cooled, and is utilized as a heat insulating material.
The porous material 10A includes: a first porous layer 11 deposited on a surface 20a that is a part to be exposed to high temperature in the substrate 20 to be cooled and formed by self-organization; and a second porous layer 12 that is deposited with a ceramic material prepared by kneading a burned hollow ceramic particle 111 and a joining material 112 on the first porous layer 11 and is formed by burning at a temperature Tb that is lower than a temperature Th at which the ceramic particle 111 is burned. The first porous layer 11 is, in particular, a mesoporous silica thin film, of which porous structure is formed by self-organization, and which is joined to the substrate 20 by self-organization.
SAWADA DAISAKU
YAMASHITA HIDEO
Toshiyuki Hatta
High Yoshitaka Hayashi