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Title:
POROUS RESIN SHEET AND METHOD FOR MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2013213198
Kind Code:
A
Abstract:

To provide a porous resin sheet that is a thick film having a thickness of at least 1 mm, has a low dielectric constant and dielectric loss tangent, and has a high elastic modulus, and a method for manufacturing same.

A single-layered porous resin sheet that includes a thermoplastic resin has a thickness of at least 1.0 mm, a relative permittivity of 2.00 or less at 1 GHz, a dielectric loss tangent of 0.0050 or less, and a tensile modulus of at least 200 MPa. Also, a method for manufacturing the porous resin sheet comprises a gas impregnation process in which a non-reactive gas is impregnated under increased pressure into a thermoplastic resin composition containing at least the thermoplastic resin, and a foaming process in which the thermoplastic resin composition is foamed by decreasing the pressure after the gas impregnation process. The porous resin sheet is employed as a patch antenna used particularly in a mobile phone antenna.


Inventors:
IKENAGA HIROKO
KASAGI TOMOYUKI
SUTO TAKESHI
UKEI HIROICHI
Application Number:
JP2013042130A
Publication Date:
October 17, 2013
Filing Date:
March 04, 2013
Export Citation:
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Assignee:
NITTO DENKO CORP
International Classes:
C08J9/12; C08J9/36
Domestic Patent References:
JP2007291202A2007-11-08
JP2006111708A2006-04-27
JP2008238483A2008-10-09
JP2010179289A2010-08-19
JP2001055464A2001-02-27
JP2009185128A2009-08-20
Attorney, Agent or Firm:
Patent Business Corporation Unias International Patent Office



 
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