Title:
多孔質基材のコーティング方法
Document Type and Number:
Japanese Patent JP2014508640
Kind Code:
A
Abstract:
The present invention relates to a method of coating a porous substrate. The method includes forming a first coating on the substrate that at least partially fills the pores of the substrate, forming a second coating on the substrate, and optionally at least partially restoring the porosity of the porous substrate.
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Inventors:
Dong Chang An
Christopher Wong
Rene Berry
Christopher Wong
Rene Berry
Application Number:
JP2013554534A
Publication Date:
April 10, 2014
Filing Date:
February 14, 2012
Export Citation:
Assignee:
DOW CORNING CORPORATION
International Classes:
B01D69/10; B01D69/12; B01D71/02
Domestic Patent References:
| JP2008520403A | 2008-06-19 | |||
| JPH0235922A | 1990-02-06 | |||
| JPH1085568A | 1998-04-07 | |||
| JP2006326410A | 2006-12-07 | |||
| JPH05192551A | 1993-08-03 | |||
| JPH1176773A | 1999-03-23 | |||
| JPH09192460A | 1997-07-29 | |||
| JPS5695304A | 1981-08-01 | |||
| JPH03119A | 1991-01-07 | |||
| JPS62163704A | 1987-07-20 | |||
| JPH06269650A | 1994-09-27 |
Foreign References:
| WO2006034575A1 | 2006-04-06 | |||
| US6113794A | 2000-09-05 | |||
| US20050077232A1 | 2005-04-14 |
Attorney, Agent or Firm:
Kenji Sugimura
Kengo Yoshida
Yoshie Sakurada
Kengo Yoshida
Yoshie Sakurada