Title:
携帯電子機器及びそのカスタマイズ画像取得モジュール
Document Type and Number:
Japanese Patent JP7315620
Kind Code:
B2
Abstract:
A portable electronic device and a customized image-capturing module thereof are provided. The customized image-capturing module includes a carrier substrate, an image-capturing chip, and a lens assembly. The carrier substrate includes a carrier body, a plurality of first conductive pads, and a plurality of second conductive pads. The image-capturing chip is disposed inside a concave space of the carrier body, and the image-capturing chip includes a plurality of conductive chip pads. The second conductive pads are exposed from a bottom side of the carrier body, the conductive chip pads are electrically connected to the second conductive pads through the first conductive pads, respectively, so that when the customized image-capturing module is partially disposed inside a receiving space and positioned between two electronic elements, the second conductive pads can be electrically connected to conductive substrate pads of a circuit substrate through soldering materials, respectively.
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Inventors:
李 聰▲結▼
Yasuyasu Hayashi
Shimoto
Ding Kensetsu
Yasuyasu Hayashi
Shimoto
Ding Kensetsu
Application Number:
JP2021087704A
Publication Date:
July 26, 2023
Filing Date:
May 25, 2021
Export Citation:
Assignee:
Haihua Technology Co., Ltd.
International Classes:
H04N23/50; H01L23/12; H04N23/55; H04N23/57
Domestic Patent References:
| JP2012002378A1 | ||||
| JP2005340539A | ||||
| JP2009080166A |
Attorney, Agent or Firm:
Yasuhiko Murayama
Shinya Mihiro
Tatsuhiko Abe
Shinya Mihiro
Tatsuhiko Abe