Title:
位置調整方法及び基板処理システム
Document Type and Number:
Japanese Patent JP4069081
Kind Code:
B2
Abstract:
According to the present invention, in a coating treatment apparatus comprising a rotary holding member and a coating solution discharge member, positional adjustment of the holding position of the substrate with respect to the rotary holding member and a discharge position of a coating solution discharge member is quickly and accurately performed, so that the time required for the positional adjustment can be shortened. Further, variations in accuracy of the positional adjustment depending on the degree of proficiency of operator can be eliminated, realizing positional adjustment with a high precision at all times.
Inventors:
Michio Tanaka
Takehide Yamashita
Takehide Yamashita
Application Number:
JP2004005726A
Publication Date:
March 26, 2008
Filing Date:
January 13, 2004
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
B05D3/00; H01L21/027; B05C11/00; B05C11/08; B05C11/10; G03C5/00; H01L21/00; H01L21/68
Domestic Patent References:
| JP2000223403A | ||||
| JP8031732A | ||||
| JP2003289035A | ||||
| JP5013037U | ||||
| JP63131133U | ||||
| JP63124737U |
Foreign References:
| WO2002059960A1 |
Attorney, Agent or Firm:
Tetsuo Kanamoto
Miaki Kametani
Koji Hagiwara
Miaki Kametani
Koji Hagiwara