Title:
POSITIONING DEVICE FOR HOT STAMP PROCESSING
Document Type and Number:
Japanese Patent JP2022112739
Kind Code:
A
Abstract:
To provide a positioning device for hot stamp processing which can prevent a panel after press molding by a mold from biting a pilot pin by contraction due to heat release, and can prevent the panel from being shifted on the mold during lift up.SOLUTION: A positioning device 10 for hot stamp processing includes a pilot pin 11, and a driving mechanism 12 for driving the pilot pin 11. The driving mechanism 12 positions the pilot pin 11 at a projection position where a tip part 11a of the pilot pin 11 and a body part 11b on a base end side with respect to the tip part 11a project from a pin guide hole 14h before a plate material 13 is supplied to a press mold 14. The driving mechanism 12 positions the pilot pin 11 at an immersion position where the body part 11b of the pilot pin 11 is immersed in the pin guide hole 14h and only the tip part 11a of the pilot pin 11 projects from the pin guide hole 14h before a step of releasing heat of the plate material 13a after molding by the press mold 14 with the press mold 14.SELECTED DRAWING: Figure 6
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Inventors:
FUJIMOTO SATOSHI
KATO HIDE
KATO HIDE
Application Number:
JP2021008655A
Publication Date:
August 03, 2022
Filing Date:
January 22, 2021
Export Citation:
Assignee:
TOPRE CORP
International Classes:
B21D43/00; B21D22/20
Attorney, Agent or Firm:
Hidekazu Miyoshi
Shunichi Takahashi
Masakazu Ito
Toshio Takamatsu
Shunichi Takahashi
Masakazu Ito
Toshio Takamatsu
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