Title:
POSITIONING DEVICE FOR WAFER
Document Type and Number:
Japanese Patent JPS57186340
Kind Code:
A
Abstract:
PURPOSE:To make positioning accurate regardless of the size of the wafer by conforming the reference plane of a positioning plate to the notch section of a semiconductor wafer being carried by means of a belt, transporting the wafer up to the rotary roller of a post stage and directing the notch section of the wafer in the predetemined direction. CONSTITUTION:When the smiconductor wafer from the belt 1 is shifted onto the belt 2 of the device and positioned onto the rotary roller 11, the roller 11 is turned, and the reference surface 10 of the positioning plate 12 oscillated by a guide 13 and an auxiliary guide 14 and the notch section of the wafer are conformed. The wafer positioned is forwarded up to the upper section of a base surface 20a forming the rotary mechanism of the next stage by means of the belt 2, the base surface 20a is elevated, the wafer is positioned onto the surface 20a, a wafer detecting switch 25 incorporating a light emitting element and a light receiving element is operated, and the notch section of the wafer is directed in the predetemined direction by means of the rotary rollers 24a, 24b.
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Inventors:
MIWA KENJI
HASHIMOTO NORIYOSHI
HASHIMOTO NORIYOSHI
Application Number:
JP7117181A
Publication Date:
November 16, 1982
Filing Date:
May 12, 1981
Export Citation:
Assignee:
NIPPON KOGAKU KK
International Classes:
H01L21/30; B65G47/244; B65G49/07; G03F7/20; H01L21/027; H01L21/677; H01L21/68; (IPC1-7): H01L21/30