Title:
POSITIVE PHOTORESIST COMPOSITION
Document Type and Number:
Japanese Patent JP2002091005
Kind Code:
A
Abstract:
To provide a positive photoresist composition excellent in resolving power and ensuring few particles and few development defects in the production of a semiconductor device.
The positive photoresist composition contains (A) resin containing repeating units represented by a specified structure and having solubility in an alkali developing solution increased by the action of acid and (B) a compound which generates acid when irradiated with active light or radiation.
Inventors:
SASAKI TOMOYA
MIZUTANI KAZUYOSHI
YASUNAMI SHOICHIRO
MIZUTANI KAZUYOSHI
YASUNAMI SHOICHIRO
Application Number:
JP2000285668A
Publication Date:
March 27, 2002
Filing Date:
September 20, 2000
Export Citation:
Assignee:
FUJI PHOTO FILM CO LTD
International Classes:
G03F7/039; C08F20/28; C08F30/08; C08F32/08; C08K5/00; C08L33/14; C08L43/04; C08L45/00; G03F7/004; H01L21/027; (IPC1-7): G03F7/039; C08F20/28; C08F30/08; C08F32/08; C08K5/00; C08L33/14; C08L43/04; C08L45/00; G03F7/004; H01L21/027
Attorney, Agent or Firm:
Shohei Oguri (4 outside)